Sonae UK Ltd is pleased to introduce two new flooring products – t–dek and safe–t–dek.

The new T-dek composite panels for flooring applications consist of a rigid extruded polystyrene layer providing thermal insulation bonded to a tongue and groove chipboard panel. T-dek consists of a rigid polystyrene foam panel of either 60mm or 80mm bonded to a 18mm chipboard panel.

The high performance rigid extruded polystyrene insulation has thermal conductivity of 0.029-0.039 W/m.K and good compression strength. Its closed cell structure means it is not absorbent to water and will not absorb ground moisture. It has an indefinite life, with its durability depending upon the conditions of use. 

The insulation layer has a smooth, dense skin which makes it ideal to bond to the 18mm chipboard. The resulting composite T-dek product is ideal for new build and refurbishment applications as it is easy to handle and install and removes the need for a vapour control layer. Moreover it is CFC/HCFC-free with zero Ozone Depletion Potential (ODP).

With the Safe-T-dek product the composite panel also has a peel clean polypropylene film on its surface to protect the floor during building works. This textured film provides an anti slip and water resistant layer strong enough to resist tearing and impact stresses. Upon completion of building works the film is easily removed to leave a clean and dry final floor covering. 

Brochure

Click here to download t-dek & safe-t-dek brochure